Technology

ARO-The Scientific Journal of Koya University

Koya University · Iraq · ISSN 2307-549X
No APC DOI Verified OA Visit journal
Articles
381

ARO-The Scientific Journal of Koya University is a peer-reviewed english-language open-access journal published by Koya University in Iraq, operating under an open-access model since 2013. The journal covers Technology and Science.

Authors publish in ARO-The Scientific Journal of Koya University without paying any article processing charge (APC) — making it a fully diamond/platinum open-access venue, supported entirely by its publisher or sponsor. Articles are released under the CC BY-NC-SA license (see other journals using this license).

To date, ARO-The Scientific Journal of Koya University has published 381 articles. Articles are minted with DOIs through the prefix 10.14500.

Keywords

engineering, technology

At a glance

Publisher
Koya University
Country
Iraq
Primary language
English
License
CC BY-NC-SA
Peer review
Double anonymous peer review
OA since
2013
DOI prefix
10.14500

ISSN

print
2410-9355
electronic
2307-549X

Frequently asked questions

Is ARO-The Scientific Journal of Koya University peer-reviewed?
Yes — ARO-The Scientific Journal of Koya University operates a Double anonymous peer review review process.
Does ARO-The Scientific Journal of Koya University charge an article processing charge (APC)?
No. ARO-The Scientific Journal of Koya University does not charge any APC. Publication is free for accepted authors.
What subjects does ARO-The Scientific Journal of Koya University publish?
ARO-The Scientific Journal of Koya University publishes research in Technology and Science.
What languages does ARO-The Scientific Journal of Koya University accept?
ARO-The Scientific Journal of Koya University accepts manuscripts in English.
What is the ISSN of ARO-The Scientific Journal of Koya University?
ISSN: 2410-9355 (print) · 2307-549X (electronic).
How do I submit a manuscript to ARO-The Scientific Journal of Koya University?
Submit through the journal's official portal: visit submission page →

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