Technology (General): Industrial engineering. Management engineering: Information technology

Interaction Design and Architecture(s)

ASLERD · Italy · ISSN 2283-2998
No APC Verified OA Visit journal

Interaction Design and Architecture(s) is a peer-reviewed english-language open-access journal published by ASLERD in Italy, operating under an open-access model since 2005. The journal covers Technology (General): Industrial engineering. Management engineering: Information technology.

Authors publish in Interaction Design and Architecture(s) without paying any article processing charge (APC) — making it a fully diamond/platinum open-access venue, supported entirely by its publisher or sponsor. Articles are released under the CC BY-NC-ND license (see other journals using this license).

Keywords

technology mediated experience, social innovation, technology enhanced learning, computer science applications

At a glance

Publisher
ASLERD
Country
Italy
Primary language
English
License
CC BY-NC-ND
Peer review
Double anonymous peer review
OA since
2005

ISSN

print
1826-9745
electronic
2283-2998

Frequently asked questions

Is Interaction Design and Architecture(s) peer-reviewed?
Yes — Interaction Design and Architecture(s) operates a Double anonymous peer review review process.
Does Interaction Design and Architecture(s) charge an article processing charge (APC)?
No. Interaction Design and Architecture(s) does not charge any APC. Publication is free for accepted authors.
What subjects does Interaction Design and Architecture(s) publish?
Interaction Design and Architecture(s) publishes research in Technology (General): Industrial engineering. Management engineering: Information technology.
What languages does Interaction Design and Architecture(s) accept?
Interaction Design and Architecture(s) accepts manuscripts in English.
What is the ISSN of Interaction Design and Architecture(s)?
ISSN: 1826-9745 (print) · 2283-2998 (electronic).
How do I submit a manuscript to Interaction Design and Architecture(s)?
Submit through the journal's official portal: visit submission page →

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