International Journal of Engineering Materials and Manufacture is a peer-reviewed english-language open-access journal published by Deer Hill Publications in Malaysia, operating under an open-access model since 2016. The journal covers Electrical engineering. Electronics. Nuclear engineering: Materials of engineering and construction. Mechanics of materials.
Authors are required to pay an article processing charge to publish in International Journal of Engineering Materials and Manufacture; refer to the journal's APC page for the current rate. Articles are released under the CC BY license (see other journals using this license).
Keywords
engineering materials, manufacturing engineering, micro/nano manufacturing, manufacturing systems
At a glance
- Publisher
- Deer Hill Publications
- Country
- Malaysia
- Primary language
- English
- License
- CC BY
- Peer review
- Anonymous peer review
- OA since
- 2016
ISSN
- electronic
- 0128-1852
Frequently asked questions
Is International Journal of Engineering Materials and Manufacture peer-reviewed?
Yes — International Journal of Engineering Materials and Manufacture operates a Anonymous peer review review process.
Does International Journal of Engineering Materials and Manufacture charge an article processing charge (APC)?
Yes — refer to the journal's APC page for the current rate.
What subjects does International Journal of Engineering Materials and Manufacture publish?
International Journal of Engineering Materials and Manufacture publishes research in Electrical engineering. Electronics. Nuclear engineering: Materials of engineering and construction. Mechanics of materials.
What languages does International Journal of Engineering Materials and Manufacture accept?
International Journal of Engineering Materials and Manufacture accepts manuscripts in English.
What is the ISSN of International Journal of Engineering Materials and Manufacture?
ISSN:
0128-1852 (electronic).How do I submit a manuscript to International Journal of Engineering Materials and Manufacture?
Submit through the journal's official portal: visit submission page →