Technology

Journal of Industry-University Collaboration

Emerald Publishing · United Kingdom · ISSN 2631-357X
No APC DOI Verified OA Visit journal
Articles
23

Journal of Industry-University Collaboration is a peer-reviewed english-language open-access journal published by Emerald Publishing in United Kingdom, operating under an open-access model since 2019. The journal covers Technology and Social Sciences.

Authors publish in Journal of Industry-University Collaboration without paying any article processing charge (APC) — making it a fully diamond/platinum open-access venue, supported entirely by its publisher or sponsor. Articles are released under the CC BY license (see other journals using this license).

To date, Journal of Industry-University Collaboration has published 23 articles. Articles are minted with DOIs through the prefix 10.1108.

Keywords

innovation, education, collaboration, industry-university cooperation

At a glance

Publisher
Emerald Publishing
Country
United Kingdom
Primary language
English
License
CC BY
Peer review
Peer review
OA since
2019
DOI prefix
10.1108

ISSN

electronic
2631-357X

Frequently asked questions

Is Journal of Industry-University Collaboration peer-reviewed?
Yes — Journal of Industry-University Collaboration operates a Peer review review process.
Does Journal of Industry-University Collaboration charge an article processing charge (APC)?
No. Journal of Industry-University Collaboration does not charge any APC. Publication is free for accepted authors.
What subjects does Journal of Industry-University Collaboration publish?
Journal of Industry-University Collaboration publishes research in Technology and Social Sciences.
What languages does Journal of Industry-University Collaboration accept?
Journal of Industry-University Collaboration accepts manuscripts in English.
What is the ISSN of Journal of Industry-University Collaboration?
ISSN: 2631-357X (electronic).
How do I submit a manuscript to Journal of Industry-University Collaboration?
Submit through the journal's official portal: visit submission page →

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