Journal of Materials Science: Materials in Engineering is a peer-reviewed english-language open-access journal published by SpringerOpen in United Kingdom, operating under an open-access model since 2024. The journal covers Electrical engineering. Electronics. Nuclear engineering: Materials of engineering and construction. Mechanics of materials.
Authors are required to pay an article processing charge to publish in Journal of Materials Science: Materials in Engineering; refer to the journal's APC page for the current rate. A waiver policy is offered for eligible authors. Articles are released under the CC BY license (see other journals using this license).
Keywords
mechanical engineering, materials science, machining
At a glance
- Publisher
- SpringerOpen
- Country
- United Kingdom
- Primary language
- English
- License
- CC BY
- Peer review
- Anonymous peer review
- OA since
- 2024
ISSN
- electronic
- 3004-8958
Frequently asked questions
Is Journal of Materials Science: Materials in Engineering peer-reviewed?
Yes — Journal of Materials Science: Materials in Engineering operates a Anonymous peer review review process.
Does Journal of Materials Science: Materials in Engineering charge an article processing charge (APC)?
Yes — refer to the journal's APC page for the current rate. A waiver policy is available for eligible authors.
What subjects does Journal of Materials Science: Materials in Engineering publish?
Journal of Materials Science: Materials in Engineering publishes research in Electrical engineering. Electronics. Nuclear engineering: Materials of engineering and construction. Mechanics of materials.
What languages does Journal of Materials Science: Materials in Engineering accept?
Journal of Materials Science: Materials in Engineering accepts manuscripts in English.
What is the ISSN of Journal of Materials Science: Materials in Engineering?
ISSN:
3004-8958 (electronic).How do I submit a manuscript to Journal of Materials Science: Materials in Engineering?
Submit through the journal's official portal: visit submission page →