Journal of Technology Informatics and Engineering is a peer-reviewed english-language open-access journal published by Universitas Sains dan Teknologi Komputer in Indonesia, operating under an open-access model since 2022. The journal covers Technology (General): Industrial engineering. Management engineering: Information technology.
Authors are required to pay an article processing charge to publish in Journal of Technology Informatics and Engineering; refer to the journal's APC page for the current rate. A waiver policy is offered for eligible authors. Articles are released under the CC BY-SA license (see other journals using this license).
Keywords
information technology, computer science, software engineering, information systems
At a glance
- Publisher
- Universitas Sains dan Teknologi Komputer
- Country
- Indonesia
- Primary language
- English
- License
- CC BY-SA
- Peer review
- Double anonymous peer review
- OA since
- 2022
ISSN
- 2961-9068
- electronic
- 2961-8215
Frequently asked questions
Is Journal of Technology Informatics and Engineering peer-reviewed?
Yes — Journal of Technology Informatics and Engineering operates a Double anonymous peer review review process.
Does Journal of Technology Informatics and Engineering charge an article processing charge (APC)?
Yes — refer to the journal's APC page for the current rate. A waiver policy is available for eligible authors.
What subjects does Journal of Technology Informatics and Engineering publish?
Journal of Technology Informatics and Engineering publishes research in Technology (General): Industrial engineering. Management engineering: Information technology.
What languages does Journal of Technology Informatics and Engineering accept?
Journal of Technology Informatics and Engineering accepts manuscripts in English.
What is the ISSN of Journal of Technology Informatics and Engineering?
ISSN:
2961-9068 (print) · 2961-8215 (electronic).How do I submit a manuscript to Journal of Technology Informatics and Engineering?
Submit through the journal's official portal: visit submission page →