Research and Practice in Technology Enhanced Learning is a peer-reviewed english-language open-access journal published by The Asia-Pacific Society for Computers in Education (APSCE) in Taiwan, Province of China, operating under an open-access model since 2015. The journal covers Technology (General): Industrial engineering. Management engineering: Information technology and Education.
Authors publish in Research and Practice in Technology Enhanced Learning without paying any article processing charge (APC) — making it a fully diamond/platinum open-access venue, supported entirely by its publisher or sponsor. Articles are released under the CC BY license (see other journals using this license).
Keywords
educational technology, learning & instruction
At a glance
- Country
- Taiwan, Province of China
- Primary language
- English
- License
- CC BY
- Peer review
- Double anonymous peer review
- OA since
- 2015
ISSN
- electronic
- 1793-7078
Frequently asked questions
Is Research and Practice in Technology Enhanced Learning peer-reviewed?
Yes — Research and Practice in Technology Enhanced Learning operates a Double anonymous peer review review process.
Does Research and Practice in Technology Enhanced Learning charge an article processing charge (APC)?
No. Research and Practice in Technology Enhanced Learning does not charge any APC. Publication is free for accepted authors.
What subjects does Research and Practice in Technology Enhanced Learning publish?
Research and Practice in Technology Enhanced Learning publishes research in Technology (General): Industrial engineering. Management engineering: Information technology and Education.
What languages does Research and Practice in Technology Enhanced Learning accept?
Research and Practice in Technology Enhanced Learning accepts manuscripts in English.
What is the ISSN of Research and Practice in Technology Enhanced Learning?
ISSN:
1793-7078 (electronic).How do I submit a manuscript to Research and Practice in Technology Enhanced Learning?
Submit through the journal's official portal: visit submission page →