Technology (General): Industrial engineering. Management engineering: Information technology

物联网学报

Chinese Journal on Internet of Things
China InfoCom Media Group · China · ISSN 2096-3750
Has APC Verified OA Visit journal

物联网学报 is a peer-reviewed chinese-language open-access journal published by China InfoCom Media Group in China, operating under an open-access model since 2017. The journal covers Technology (General): Industrial engineering. Management engineering: Information technology and Technology (General): Industrial engineering. Management engineering: Management information systems.

Authors are required to pay an article processing charge to publish in 物联网学报; refer to the journal's APC page for the current rate. Articles are released under the CC BY-NC-ND license (see other journals using this license).

All submissions undergo plagiarism screening before peer review.

Keywords

intelligent information system, structural theory, information sensing technology, intelligent connection technology, data fusion processing, security control

At a glance

Country
China
Primary language
Chinese
License
CC BY-NC-ND
Peer review
Double anonymous peer review
OA since
2017
Review time
20 weeks
Plagiarism check
Yes

ISSN

print
2096-3750

Frequently asked questions

Is 物联网学报 peer-reviewed?
Yes — 物联网学报 operates a Double anonymous peer review review process.
Does 物联网学报 charge an article processing charge (APC)?
Yes — refer to the journal's APC page for the current rate.
What subjects does 物联网学报 publish?
物联网学报 publishes research in Technology (General): Industrial engineering. Management engineering: Information technology and Technology (General): Industrial engineering. Management engineering: Management information systems.
What languages does 物联网学报 accept?
物联网学报 accepts manuscripts in Chinese.
What is the ISSN of 物联网学报?
ISSN: 2096-3750 (print).
How do I submit a manuscript to 物联网学报?
Submit through the journal's official portal: visit submission page →
How long does peer review take at 物联网学报?
Average time from submission to publication is approximately 20 weeks.

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