Journal of Applied Science, Information and Computing is a peer-reviewed english-language open-access journal published by Kampala International University in Uganda, operating under an open-access model since 2020. The journal covers Mathematics: Instruments and machines: Electronic computers. Computer science.
Authors publish in Journal of Applied Science, Information and Computing without paying any article processing charge (APC) — making it a fully diamond/platinum open-access venue, supported entirely by its publisher or sponsor. Articles are released under the CC BY license (see other journals using this license).
Keywords
applied science, information technology, computing, machine learning, artificial intelligence, interdisciplinary research
At a glance
- Publisher
- Kampala International University
- Country
- Uganda
- Primary language
- English
- License
- CC BY
- Peer review
- Double anonymous peer review
- OA since
- 2020
ISSN
- electronic
- 3007-8903
Frequently asked questions
Is Journal of Applied Science, Information and Computing peer-reviewed?
Yes — Journal of Applied Science, Information and Computing operates a Double anonymous peer review review process.
Does Journal of Applied Science, Information and Computing charge an article processing charge (APC)?
No. Journal of Applied Science, Information and Computing does not charge any APC. Publication is free for accepted authors.
What subjects does Journal of Applied Science, Information and Computing publish?
Journal of Applied Science, Information and Computing publishes research in Mathematics: Instruments and machines: Electronic computers. Computer science.
What languages does Journal of Applied Science, Information and Computing accept?
Journal of Applied Science, Information and Computing accepts manuscripts in English.
What is the ISSN of Journal of Applied Science, Information and Computing?
ISSN:
3007-8903 (electronic).How do I submit a manuscript to Journal of Applied Science, Information and Computing?
Submit through the journal's official portal: visit submission page →