Revista de Universidad y Sociedad del Conocimiento is a peer-reviewed spanish-language open-access journal published by Universitat Oberta de Catalunya in Spain, operating under an open-access model since 2004. The journal covers Special aspects of education and Technology (General): Industrial engineering. Management engineering: Information technology.
Authors publish in Revista de Universidad y Sociedad del Conocimiento without paying any article processing charge (APC) — making it a fully diamond/platinum open-access venue, supported entirely by its publisher or sponsor. Articles are released under the CC BY license (see other journals using this license).
Keywords
e-learning, higher education, knowledge society
At a glance
- Publisher
- Universitat Oberta de Catalunya
- Country
- Spain
- Primary language
- Spanish
- License
- CC BY
- Peer review
- Double anonymous peer review
- OA since
- 2004
ISSN
- electronic
- 1698-580X
Manuscript languages
Frequently asked questions
Is Revista de Universidad y Sociedad del Conocimiento peer-reviewed?
Yes — Revista de Universidad y Sociedad del Conocimiento operates a Double anonymous peer review review process.
Does Revista de Universidad y Sociedad del Conocimiento charge an article processing charge (APC)?
No. Revista de Universidad y Sociedad del Conocimiento does not charge any APC. Publication is free for accepted authors.
What subjects does Revista de Universidad y Sociedad del Conocimiento publish?
Revista de Universidad y Sociedad del Conocimiento publishes research in Special aspects of education and Technology (General): Industrial engineering. Management engineering: Information technology.
What languages does Revista de Universidad y Sociedad del Conocimiento accept?
Revista de Universidad y Sociedad del Conocimiento accepts manuscripts in English and Spanish.
What is the ISSN of Revista de Universidad y Sociedad del Conocimiento?
ISSN:
1698-580X (electronic).How do I submit a manuscript to Revista de Universidad y Sociedad del Conocimiento?
Submit through the journal's official portal: visit submission page →